assembly technologies
Through Hole Technology
As an optimal complement to fully automatic PCB assembly, we offer conventional Through Hole Technology (THT). This means we are ideally positioned for the often desired mixed assembly of PCBs- with a combination of SMD and THT components.
In THT production, the printed circuit board is assembled manually with great sensitivity. Our experienced employees insert wired components through the contact holes and solder them. In this process, the entire assembly is passed over a hot stream of liquid solder in a wave soldering machine. The solder wave wets the inserted pins with solder ¬– and thus establishes the electrical contact with the conductor paths. We can cover a soldering area of 400 x 400 mm.
Our automatic selective soldering system SPA 440 EVO and manual soldering are used for THT soldering points that are difficult to access, for example with double-sided assembly.
Advantages of selective soldering:
With selective soldering, THT components can be subsequently soldered onto already
assembled PCBs. The soldering parameters for each solder joint can be set individually.
This means that selective soldering is mainly used when full-surface soldering methods
such as wave soldering are not possible due to the process or when high precision and quality
are required.
Other advantages of selective soldering are:
- Each solder joint can be individually programmed; flux quantity and soldering time can be precisely adjusted
- High quality of the solder joint (without overheating of components)
- High process reliability and stability
- Low thermal stress for the PCB and adjacent components
- Guaranteed reproducibility
- Increased flexibility: enables soldering of PCBs containing masses that are difficult to process
- with wave soldering systems.
Compared to the SMT process, the manual THT process is much more time-consuming. Nevertheless, it is still indispensable for certain components, such as plugs and switches.
THT-equipment
- Automatic selective soldering system SPA 440 EVO
- Hand soldering is also possible
application examples
SMT-Surface Mounting Technology
Fully automatic circuit board assembly
With the SMT production line, we can manufacture compact and highly individual PCBs for you in the shortest possible time – and at an excellent price-performance ratio.
We are able to produce PCBs up to a size of 300 x 400 x 4 mm as standard. However, larger assemblies are also possible by arrangement.
Placement output: up to 12,000 components per hour
Your advantages through SMT production at miunske:
- Miniaturization: significant reduction in size and weight of the printed circuit boards
- Lower costs due to flexible PCB design and technology (SMT and THT)
- Improvement of the high-frequency properties due to the smaller component spacing
- Shorter production times through automated SMD assembly
- Highest product quality through AOI (automatic optical inspection) and flying probe test system
- Excellent price-performance ratio, especially for small batches
- Sufficient capacity reserves - also for short-term appointment services
„With our new SMT production line, we will be able to offer customers even more flexibility and customization options in the future. “
Matthias Schuster, Production manager miunske GmbH
Press-fit technology
In addition to THT and SMT assembly, miunske offers press-fit technology with customized components, especially for the production of high-performance components in compact designs. Therefore, you can expect even more robust and individually manufactured electronic components from miunske in the future.
- Flat plug socket 6.3 & 9.5 mm
- JPT connector 2 rows: 2x5, 2x9
- JPT connector 3 rows A-coded: 3x2, 3x3, 3x4, 3x5, 3x6, 3x7 (black, brown, blue, yellow, grey, green, purple)
- JPT contacts in silver-plated version possible
- Relay socket micro & mini
- Power connections with internal thread: M5-M8
- Power connections with external thread: M4-M10
- Flat plug: 2.8 & 6.3 mm
Advantages of press-fit technology:
- Minimization of the installation space through even more compact components
- Low contact resistances, especially with high continuous current loads
- High resistance to climatic and mechanical stresses
- Minimal risk of failure, e.g. due to cold solder joints
- Environmentally friendly, due to the absence of solder and flux or lead-free materials